| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
1500.0 MEGOHM-MICROFARADS |
| ABTD |
MOUNTING SLOT WIDTH |
0.156 INCHES NOMINAL |
| AXHR |
MOUNTING FACILITY TYPE AND QUANTITY |
1 MOUNTING SLOTS |
| ADAQ |
BODY LENGTH |
1.312 INCHES NOMINAL |
| ABHP |
OVERALL LENGTH (NON-CORE) |
2.312 INCHES NOMINAL |
| AAQL |
BODY STYLE |
W/MTG TABS/FLANGES TERMINAL(S) ON ONE SURFACE |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-C-25 SPECIFICATION |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 TAB, SOLDER LUG |
| ADAU |
BODY HEIGHT |
2.000 INCHES NOMINAL |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
400.0 DC SINGLE SECTION |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
1.000 MICROFARADS SINGLE SECTION |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| ABMK |
OVERALL WIDTH (NON-CORE) |
0.766 INCHES MAXIMUM |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
2.781 INCHES MAXIMUM |
| CWJK |
CASE MATERIAL |
METAL |
| AEBY |
DISTANCE BETWEEN CENTERLINES OF MOUNTING FACILITIES PARALLEL TO BODY LENGTH |
1.938 INCHES NOMINAL |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 85.0 DEG CELSIUS MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED CASE |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
1.0000 |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
15.0 MEGOHM-MICROFARADS |
| ADAT |
BODY WIDTH |
0.766 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |