| CQBQ |
CAPACITANCE VALUE PER SECTION |
470.000 PICOFARADS SINGLE SECTION |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CWJK |
CASE MATERIAL |
GLASS |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
250.0 DC SINGLE SECTION |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
2.5000 |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
0.250 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.025 INCHES MAXIMUM |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
1000.0 MEGOHMS |
| CQFB |
VOLTAGE TEMP LIMITS PER SECTION IN PERCENT CAPACITANCE CHANGE |
-30.0/+10.0 WITH RATED VOLTAGE APPLIED SINGLE SECTION |
| ABMK |
OVERALL WIDTH (NON-CORE) |
0.250 INCHES MAXIMUM |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| ABPM |
BODY DIAMETER |
0.250 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ABHP |
OVERALL LENGTH (NON-CORE) |
0.025 INCHES MAXIMUM |