| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 TAB, SOLDER LUG |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
10.0 MEGOHM-MICROFARADS |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
1.000 MICROFARADS SINGLE SECTION |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| ABPM |
BODY DIAMETER |
0.670 INCHES NOMINAL |
| AFHW |
INTERNAL ELECTRICAL CONNECTION TYPE |
EXTENDED FOIL |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
0.670 INCHES NOMINAL |
| CWJK |
CASE MATERIAL |
METAL |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| AAQL |
BODY STYLE |
W/MTG BRACKET, AXIAL TERMINALS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED CASE |
| ABMK |
OVERALL WIDTH (NON-CORE) |
0.670 INCHES NOMINAL |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
1.0000 |
| ADAQ |
BODY LENGTH |
1.625 INCHES NOMINAL |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
100.0 DC SINGLE SECTION |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
20000.0 MEGOHM-MICROFARADS |