| PRMT |
PRECIOUS MATERIAL (NON-CORE) |
GOLD |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
6.000 |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
6.800 MICROFARADS SINGLE SECTION |
| CWQH |
DC LEAKAGE AT REFERENCE TEMP |
3.000 MICROAMPERES |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-C-55365 SPECIFICATION |
| ADAQ |
BODY LENGTH |
0.285 INCHES NOMINAL |
| ZZZK |
SPECIFICATION/STANDARD DATA |
81349-MIL-C-55365/4 GOVERNMENT SPECIFICATION |
| AARG |
RELIABILITY INDICATOR |
ESTABLISHED |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| AECE |
ANODE TYPE |
SOLID |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
0.110 INCHES NOMINAL |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| PMLC |
PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| AAQL |
BODY STYLE |
CHIP TYPE |
| ABMK |
OVERALL WIDTH (NON-CORE) |
0.150 INCHES NOMINAL |
| CWJK |
CASE MATERIAL |
CERAMIC |
| ADAT |
BODY WIDTH |
0.150 INCHES NOMINAL |
| ADAU |
BODY HEIGHT |
0.110 INCHES NOMINAL |
| AARH |
RELIABILITY FAILURE RATE LEVEL IN PERCENT |
0.100 |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 85.0 DEG CELSIUS MAXIMUM |
| CQLH |
DC LEAKAGE AT MAXIMUM OPERATING TEMP |
30.0 MICROAMPERES |
| ABJT |
TERMINAL LENGTH |
0.050 INCHES NOMINAL |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
35.0 DC SINGLE SECTION |
| AECQ |
ELECTRICAL POLARIZATION |
POLARIZED |
| ABHP |
OVERALL LENGTH (NON-CORE) |
0.285 INCHES NOMINAL |
| CWNJ |
CAPACITIVE ELECTRODE MATERIAL |
TANTALUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |