| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
0.100 |
| CRHD |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS |
-30.0/+30.0 SINGLE SECTION |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
50.0 DC SINGLE SECTION |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| ADAQ |
BODY LENGTH |
0.116 INCHES MINIMUM AND 0.136 INCHES MAXIMUM |
| PRMT |
PRECIOUS MATERIAL (NON-CORE) |
SILVER |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
3.900 PICOFARADS SINGLE SECTION |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| CRTP |
TOLERANCE RANGE PER SECTION |
-0.25/+0.25 PICOFARADS SINGLE SECTION |
| ADAT |
BODY WIDTH |
0.053 INCHES MINIMUM AND 0.073 INCHES MAXIMUM |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CWJK |
CASE MATERIAL |
CERAMIC |
| PMLC |
PRECIOUS MATERIAL AND LOCATION |
TERMINALS SILVER |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
0.059 INCHES MAXIMUM |
| ABMK |
OVERALL WIDTH |
0.053 INCHES MINIMUM AND 0.073 INCHES MAXIMUM |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
10000.0 MEGOHMS |
| CQLZ |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS |
0.0 SINGLE SECTION |
| ABHP |
OVERALL LENGTH |
0.116 INCHES MINIMUM AND 0.136 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.059 INCHES MAXIMUM |
| ABJT |
TERMINAL LENGTH |
0.010 INCHES MINIMUM AND 0.030 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |