| CRHD |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS |
-30.0/+30.0 SINGLE SECTION |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
1.800 PICOFARADS SINGLE SECTION |
| AARH |
RELIABILITY FAILURE RATE LEVEL IN PERCENT |
0.001 |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
0.150 |
| AARG |
RELIABILITY INDICATOR |
ESTABLISHED |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
1.3 MILLIMETERS NOMINAL |
| CRTP |
TOLERANCE RANGE PER SECTION |
-0.25/+0.25 PICOFARADS SINGLE SECTION |
| ABJT |
TERMINAL LENGTH |
0.5 MILLIMETERS NOMINAL |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
1000.0 MEGOHMS |
| ABMK |
OVERALL WIDTH (NON-CORE) |
1.3 MILLIMETERS NOMINAL |
| CWJK |
CASE MATERIAL |
CERAMIC |
| ADAQ |
BODY LENGTH |
2.0 MILLIMETERS NOMINAL |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
| ADAT |
BODY WIDTH |
1.3 MILLIMETERS NOMINAL |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CQLZ |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS |
0.0 SINGLE SECTION |
| ADAU |
BODY HEIGHT |
1.3 MILLIMETERS MAXIMUM |
| ABHP |
OVERALL LENGTH (NON-CORE) |
2.0 MILLIMETERS NOMINAL |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
100.0 DC SINGLE SECTION |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |