| ABKW |
OVERALL HEIGHT |
0.020 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| AARH |
RELIABILITY FAILURE RATE LEVEL IN PERCENT |
0.001 |
| ZZZK |
SPECIFICATION/STANDARD DATA |
81349-MIL-C-55681/1 GOVERNMENT SPECIFICATION |
| ABHP |
OVERALL LENGTH |
0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-C-55681 SPECIFICATION |
| AARG |
RELIABILITY INDICATOR |
ESTABLISHED |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
0.027 MICROFARADS SINGLE SECTION |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
2.500 |
| ADAU |
BODY HEIGHT |
0.020 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| AAQL |
BODY STYLE |
CHIP TYPE |
| ADAT |
BODY WIDTH |
0.065 INCHES MINIMUM AND 0.095 INCHES MAXIMUM |
| CWJK |
CASE MATERIAL |
CERAMIC |
| ABJT |
TERMINAL LENGTH |
0.020 INCHES NOMINAL |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| ABMK |
OVERALL WIDTH |
0.065 INCHES MINIMUM AND 0.095 INCHES MAXIMUM |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
10000.0 MEGOHMS |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
100.0 DC SINGLE SECTION |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQFB |
VOLTAGE TEMP LIMITS PER SECTION IN PERCENT CAPACITANCE CHANGE |
-15.0/+15.0 WITHOUT VOLTAGE APPLIED SINGLE SECTION |