| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
4.000 |
| ABKW |
OVERALL HEIGHT (NON-CORE) |
0.7 MILLIMETERS MINIMUM |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
1.000 MICROFARADS SINGLE SECTION |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| AECE |
ANODE TYPE |
SOLID |
| ABHP |
OVERALL LENGTH (NON-CORE) |
3.5 MILLIMETERS NOMINAL |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| CRTP |
TOLERANCE RANGE PER SECTION |
-20.00/+20.00 PERCENT SINGLE SECTION |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CWJK |
CASE MATERIAL |
CERAMIC |
| ADAU |
BODY HEIGHT |
0.7 MILLIMETERS MINIMUM |
| ABJT |
TERMINAL LENGTH |
0.8 MILLIMETERS NOMINAL |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 85.0 DEG CELSIUS MAXIMUM |
| CWQH |
DC LEAKAGE AT REFERENCE TEMP |
0.500 MICROAMPERES |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
35.0 DC SINGLE SECTION |
| AECQ |
ELECTRICAL POLARIZATION |
POLARIZED |
| ADAQ |
BODY LENGTH |
3.5 MILLIMETERS NOMINAL |
| ADAT |
BODY WIDTH |
2.1 MILLIMETERS MAXIMUM |
| CWNJ |
CAPACITIVE ELECTRODE MATERIAL |
TANTALUM |
| ABMK |
OVERALL WIDTH (NON-CORE) |
2.1 MILLIMETERS MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |