| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| ABHP |
OVERALL LENGTH |
3.5 MILLIMETERS MINIMUM AND 3.9 MILLIMETERS MAXIMUM |
| ADAT |
BODY WIDTH |
1.7 MILLIMETERS MINIMUM AND 2.1 MILLIMETERS MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
10.000 NANOFARADS SINGLE SECTION |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
2.500 |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CWJK |
CASE MATERIAL |
CERAMIC |
| ABJT |
TERMINAL LENGTH |
0.2 MILLIMETERS MINIMUM AND 0.7 MILLIMETERS MAXIMUM |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
| ABMK |
OVERALL WIDTH |
1.7 MILLIMETERS MINIMUM AND 2.1 MILLIMETERS MAXIMUM |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
10000.0 MEGOHMS |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
200.0 DC SINGLE SECTION |
| ADAQ |
BODY LENGTH |
3.5 MILLIMETERS MINIMUM AND 3.9 MILLIMETERS MAXIMUM |
| ADAU |
BODY HEIGHT |
1.4 MILLIMETERS MINIMUM AND 1.8 MILLIMETERS MAXIMUM |
| ABKW |
OVERALL HEIGHT |
1.4 MILLIMETERS MINIMUM AND 1.8 MILLIMETERS MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |