| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
1000.0 MEGOHM-MICROFARADS |
| AARH |
RELIABILITY FAILURE RATE LEVEL IN PERCENT |
0.001 |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-C-55681 SPECIFICATION |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
100.0 MEGOHM-MICROFARADS |
| AARG |
RELIABILITY INDICATOR |
ESTABLISHED |
| AGAV |
END ITEM IDENTIFICATION |
6625013092825-80058 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| ADAQ |
BODY LENGTH |
0.125 INCHES NOMINAL |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
2.500 |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CWQQ |
REFERENCE TEMP AT WHICH RATED |
25.0 DEG CELSIUS |
| ABJT |
TERMINAL LENGTH |
0.020 INCHES NOMINAL |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| ADAT |
BODY WIDTH |
0.062 INCHES NOMINAL |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
12000.000 PICOFARADS SINGLE SECTION |
| ADAU |
BODY HEIGHT |
0.051 INCHES MAXIMUM |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
100.0 DC SINGLE SECTION |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQFB |
VOLTAGE TEMP LIMITS PER SECTION IN PERCENT CAPACITANCE CHANGE |
-15.0/+15.0 WITHOUT VOLTAGE APPLIED SINGLE SECTION |
| ZZZK |
SPECIFICATION/STANDARD DATA |
81349-MIL-C-55681/8 GOVERNMENT SPECIFICATION |