| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
6.000 |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| ADAU |
BODY HEIGHT |
2.2 MILLIMETERS MINIMUM AND 2.8 MILLIMETERS MAXIMUM |
| AARG |
RELIABILITY INDICATOR |
ESTABLISHED |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
15.000 MICROFARADS SINGLE SECTION |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
10.0 DC SINGLE SECTION |
| AARH |
RELIABILITY FAILURE RATE LEVEL IN PERCENT |
0.100 |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| AECQ |
ELECTRICAL POLARIZATION |
POLARIZED |
| ADAQ |
BODY LENGTH |
5.7 MILLIMETERS MINIMUM AND 6.3 MILLIMETERS MAXIMUM |
| CWNJ |
CAPACITIVE ELECTRODE MATERIAL |
TANTALUM |
| CWQH |
DC LEAKAGE AT REFERENCE TEMP |
1.500 MICROAMPERES |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 MICROFARADS SINGLE SECTION |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAT |
BODY WIDTH |
2.9 MILLIMETERS MINIMUM AND 3.5 MILLIMETERS MAXIMUM |