| AGAV |
END ITEM IDENTIFICATION |
VARIOUS |
| CRHD |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS |
-30.0/+30.0 SINGLE SECTION |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
50.0 DC SINGLE SECTION |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-C-55681 SPECIFICATION |
| AARG |
RELIABILITY INDICATOR |
ESTABLISHED |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
4700.000 PICOFARADS SINGLE SECTION |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00/+10.00 PERCENT SINGLE SECTION |
| ADAQ |
BODY LENGTH |
0.110 INCHES NOMINAL |
| ABJT |
TERMINAL LENGTH |
0.015 INCHES NOMINAL |
| AARH |
RELIABILITY FAILURE RATE LEVEL IN PERCENT |
0.0100 |
| AAQL |
BODY STYLE |
CHIP TYPE |
| ADAT |
BODY WIDTH |
0.110 INCHES NOMINAL |
| CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
0.0500 |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.102 INCHES MAXIMUM |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CWJK |
CASE MATERIAL |
CERAMIC OR GLASS |
| CQLZ |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS |
0.0 SINGLE SECTION |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
1000000.0 MEGOHMS |
| CRTL |
CRITICALITY CODE JUSTIFICATION |
AGAV |
| CQBF |
INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP |
100000.0 MEGOHMS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| FEAT |
SPECIAL FEATURES |
TERMINATION FINISH IS BASE METALLIZATION-BARRIER METAL-SOLDER COATED MIN THICK OF 60 MICRO-INCHES (TIN/LEAD ALLOY) |