5961-00-174-5743 ( 2N3670 , 116973-002 , 2N3670 , 2N3670 , 2N3670 , RELEASE4898 , 2N3670 , 2N3670 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5961-00-174-5743 | 5961 | 001745743 | SEMICONDUCTOR DEVICE,THYRISTOR | 3309 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD AND 1 CASE |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-3 |
| ALBA | ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | ANODE |
| ABBH | INCLOSURE MATERIAL | METAL |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 AMPERES FORWARD CURRENT, AVERAGE PRESET AND 2.00 AMPERES SOURCE CUTOFF CURRENT MINOR |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 600.0 MAXIMUM FORWARD VOLTAGE, PEAK AND 400.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE |
| ABKW | OVERALL HEIGHT | 0.450 INCHES MAXIMUM |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| ABHP | OVERALL LENGTH | 1.573 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 2 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| ZZZK | SPECIFICATION/STANDARD DATA | 80131-RELEASE4898 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| ABMK | OVERALL WIDTH | 1.050 INCHES MAXIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 DEG CELSIUS CASE |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| 2N3670 | 04713 | A | 9 | 3 | E | TX | |
| 116973-002 | 89022 | A | 9 | 5 | 5 | 9Z | |
| 2N3670 | 1S926 | A | 2 | 5 | E | ZZ | |
| 2N3670 | 81349 | M | 1 | C | AC | 3 | ZZ |
| 2N3670 | 80131 | A | 9 | 5 | E | TX | |
| RELEASE4898 | 80131 | A | 1 | 5 | 3 | TX | |
| 2N3670 | 55464 | A | 2 | 5 | E | ZZ | |
| 2N3670 | 34371 | A | 9 | 5 | 3 | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| 2N3670 | 04713 | FREESCALE SEMICONDUCTOR INC. | F | A |
| 116973-002 | 89022 | TDK-LAMBDA AMERICAS INC. | A | A |
| 2N3670 | 1S926 | AMERICAN MICROSEMICONDUCTOR INC | F | A |
| 2N3670 | 81349 | MILITARY SPECIFICATIONS | A | M |
| 2N3670 | 80131 | ELECTRONIC INDUSTRIES ASSOCIATIO | A | A |
| RELEASE4898 | 80131 | ELECTRONIC INDUSTRIES ASSOCIATIO | A | A |
| 2N3670 | 55464 | CENTRAL SEMICONDUCTOR CORP | A | A |
| 2N3670 | 34371 | INTERSIL CORPORATION | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | X | A | 1 | 02/24/1 | B | N | 8541300080 | 3309 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DF | N | SF9EH-N | F | ||
| DN | 9B----- | N | |||
| DS | N | I |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| A | A | N | X | B |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DS | SMS | Z | 0 | EA | 0 | U | D | ||
| DN | SMS | Z | 0 | EA | 0 | U | 9B----- | N | |
| DF | SMS | Z | 0 | EA | 0 | U | SF9EH-N | F |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 063025 | Z | 34525 | W | 72D | 3 | 9 | A | H | Z | SEMICONDUCTORS/DEVICES NOI ETC |