5961-00-464-4054 ( 1902-3357 , 1902-3357 , CD35922 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5961-00-464-4054 | 5961 | 004644054 | SEMICONDUCTOR DEVICE,DIODE | 2058 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| ABHP | OVERALL LENGTH | 0.300 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| ADAV | OVERALL DIAMETER | 0.125 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| 1902-3357 | 28480 | A | 9 | 5 | 5 | TA | |
| 1902-3357 | 50434 | A | 2 | 3 | 5 | ZZ | |
| CD35922 | 15818 | F | 9 | 5 | 1 | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| 1902-3357 | 28480 | HEWLETT PACKARD CO | A | A |
| 1902-3357 | 50434 | AVAGO TECHNOLOGIES U.S. INC. | F | A |
| CD35922 | 15818 | TELCOM SEMICONDUCTOR INC | A | F |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| U | X | Q | 05/12/1 | A | N | 8541100070 | 2058 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 063025 | Z | 34525 | W | J | 658 | Z | 9 | A | H | Z | SEMICONDUCTORS/DEVICES NOI ETC |