5961-00-483-2109 ( MC9877 , 195316-000 , C5569 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5961-00-483-2109 | 5961 | 004832109 | SEMICONDUCTOR DEVICES,UNITIZED | 6196 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CBBL | FEATURES PROVIDED | GOLD PLATED LEADS AND BURN IN |
| ASKA | COMPONENT NAME AND QUANTITY | 10 SEMICONDUCTOR DEVICE DIODE |
| AGAV | END ITEM IDENTIFICATION | P-3C ACFT |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| MC9877 | 14552 | A | 2 | 3 | 5 | KE | |
| 195316-000 | 81413 | A | 2 | 1 | 1 | KE | |
| C5569 | 16352 | A | 9 | 5 | 5 | KE |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| MC9877 | 14552 | MICROSEMI CORPORATION | A | A |
| 195316-000 | 81413 | BAE SYSTEMS INFORMATION AND | A | A |
| C5569 | 16352 | C O D I CORP | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | A | 02/01/1 | N | 8541500080 | 6196 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DN | 9B----- | N | |||
| DS | I |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| A | A | N | 0 | X |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DN | SMS | Z | 1 | EA | 0 | U | 9B----- | N | |
| DS | SMS | Z | 1 | EA | 0 | U | D |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 063025 | Z | 34525 | W | 72D | Z | 9 | A | H | Z | SEMICONDUCTORS/DEVICES NOI ETC |