5961-00-838-1700 ( 8746940-01 , 341M , 479-0007-001 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5961-00-838-1700 | 5961 | 008381700 | SEMICONDUCTOR DEVICE,DIODE | 2058 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| 8746940-01 | 98747 | A | 2 | 3 | 2 | ZZ | |
| 341M | 15818 | F | 9 | 5 | 5 | SB | |
| 479-0007-001 | 94756 | A | 9 | 5 | 2 | SB |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| 8746940-01 | 98747 | OGDEN AIR LOGISTICS CENTER | A | A |
| 341M | 15818 | TELCOM SEMICONDUCTOR INC | A | F |
| 479-0007-001 | 94756 | BOEING COMPANY, THE | F | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | A | 1 | 01/01/1 | B | N | 8541100070 | 2058 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DF | N | SF9AH-N | F | ||
| DS | N | I |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| A | A | N | 0 | X | B |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DF | SMS | Z | 1 | EA | 0 | U | SF9AH-N | F | |
| DS | SMS | Z | 1 | EA | 0 | U | D |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 063025 | A | 34525 | J | J | 659 | 3 | Z | A | H | Z | SEMICONDUCTORS/DEVICES NOI ETC SUB1 |