5961-01-239-5853 ( BYW30-100U , BYW30-100U )

NSN Information
NSN FSC NIIN Item Name INC
5961-01-239-5853 5961 012395853 SEMICONDUCTOR DEVICE,DIODE 2058
NSN Features
MRC Parameter Characteristics
PKWT UNPACKAGED UNIT WEIGHT (NON-CORE) 6.0 GRAMS
CTQN VOLTAGE RATING IN VOLTS PER CHARACTERISTIC 100.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE
AXGY MOUNTING METHOD THREADED STUD
CQJX NOMINAL THREAD SIZE 0.190 INCHES
ABBH INCLOSURE MATERIAL METAL
CTSG MAXIMUM OPERATING TEMP PER MEASUREMENT POINT 150.0 DEG CELSIUS JUNCTION
CTMZ SEMICONDUCTOR MATERIAL SILICON
ALAZ JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION DO-4
ABHP OVERALL LENGTH 31.8 MILLIMETERS MAXIMUM
CTQX CURRENT RATING PER CHARACTERISTIC 200.00 AMPERES SOURCE CUTOFF CURRENT ABSOLUTE
THSD THREAD SERIES DESIGNATOR UNF
CBBL FEATURES PROVIDED HERMETICALLY SEALED CASE
CCDG OVERALL WIDTH ACROSS FLATS 11.0 MILLIMETERS MAXIMUM
TTQY TERMINAL TYPE AND QUANTITY 1 TAB, SOLDER LUG AND 1 THREADED STUD
AKPV MOUNTING FACILITY QUANTITY 1
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
BYW30-100U 25403 F 9 3 6 TX
BYW30-100U 18324 A 2 3 5 ZZ
Manufacturers
Part SKU Cage Manufacturer Type Status
BYW30-100U 25403 PHILIPS CIRCUIT ASSEMBLIES A F
BYW30-100U 18324 PHILIPS SEMICONDUCTORS INC A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A X A 09/01/1 N 8541100070 2058
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
DA Z Q2200X- A
DS N I
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
A A N X
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
DA SMS Z 0 EA 0 U Z Q2200X- A
DS SMS Z 0 EA 0 U D
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Q 2 2 00 X
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC
063025 Z 34525 W 72D Z 9 A H Z SEMICONDUCTORS/DEVICES NOI ETC