5961-01-485-0921 ( US1G )

NSN Information
NSN FSC NIIN Item Name INC
5961-01-485-0921 5961 014850921 SEMICONDUCTOR DEVICE,DIODE 2058
NSN Features
MRC Parameter Characteristics
AGAV END ITEM IDENTIFICATION FLIGHT SIMULATOR
ABHP OVERALL LENGTH 0.157 INCHES MINIMUM AND 0.177 INCHES MAXIMUM
PKWT UNPACKAGED UNIT WEIGHT (NON-CORE) 0.002 OUNCES
SUPP SUPPLEMENTARY FEATURES (NON-CORE) JEDEC D0-214AC MOLDED PASTIC BODY OVER PASSIVATED CHIP; TERMINALS SOLDER PLATED, SOLDERABLE PER MIL-STD-750, METHOD 2026; POLARITY COLOR BAND DENOTES CATHODE END; FLAMMABILITY CLASSIFICATION 94V-0; GLASS PASSIVATED CHIP JUNCTIONS; LOW PROFILE PACKAGE; HIGH TEMPERATURE SOLDERING GUARANTEED 250 DEG C 10 SECONDS ON TERMINALS
FEAT SPECIAL FEATURES DEVICE MARKING CODE UG; MAX REPETITIVE PEAK REVERSE VOLTAGE 400; MAX RMS VOLTAGE 280; MAX DC BLOCKING VOLTAGE 400; MAX AVERAGE FORWARD RECTIFIED CURRENT AT TL =100 DEG C 1.0; PEAK FORWARD SURGE CURRENT 8.3 MS SINGLE HALF SINE-WAVE SUPERIMPOSED ON RATED LOAD 30;OPERATING AND STORAGE TEMP RANGE M55.0 TO 150.0
ABBH INCLOSURE MATERIAL PLASTIC
ABMK OVERALL WIDTH 0.100 INCHES MINIMUM AND 0.110 INCHES MAXIMUM
Manufacturing Part Numbers (SKUs)
Part SKU Cage Status RNVC RNCC SADC DAC RNAAC
US1G 14936 A 2 3 4 9Z
Manufacturers
Part SKU Cage Manufacturer Type Status
US1G 14936 GENERAL SEMICONDUCTOR INC A A
FLIS Identification
PMIC ADPE Code CRITL Code DEMIL Code DEMIL INTG NIIN Asgt ESD HMIC ENAC Schedule-B INC
A 0 X A 1 05/16/2 A N 8541100070 2058
FLIS Management
MOE REC Rep Code Mgmt Ctl USC Phrase Code Phrase Statement
Demilitarization Codes & Management
DML PMI HMIC ADP CC ESDC
Miscellaneous Management
MOE (S_A) SOS AAC QUP UI SLC CIIC RC MCC SVC
Management Control Army
MATCAT 1 MATCAT 2 MATCAT 3 MATCAT 4 5 ARC
Freight
NMFC NMFC SUB UFC HMC LTL LCL WCC TCC SHC ADC ACC ASH NMF DESC