5961-01-530-8907 ( 20038305 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5961-01-530-8907 | 5961 | 015308907 | SEMICONDUCTOR DEVICE ASSEMBLY | 3556 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | DIODE ASSEMBLY |
| ABHP | OVERALL LENGTH | 2.000 INCHES NOMINAL |
| AGAV | END ITEM IDENTIFICATION | F-15 SIMULATOR |
| AEAS | MAJOR COMPONENTS | 2 DIODES P/N H006674;1 PUSH-ON METAL NON-INSULATED CONNECTOR P/N H006324; HEAT SHRINK MATERIAL .125 X .50 P/N H006828 |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| 20038305 | 5T389 | A | 2 | 3 | 2 | ZZ |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| 20038305 | 5T389 | WASP INC. | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | A | 1 | 06/15/2 | A | N | 8541500080 | 3556 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DS | N | I | |||
| DF | N | SF9---N | F |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| A | A | N | 0 | X | A |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DF | SMS | Z | 0 | EA | 0 | U | SF9---N | F | |
| DS | SMS | Z | 0 | EA | 0 | U | D |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|