| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.830 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
W/RESISTOR AND W/ENABLE AND BURN IN AND HERMETICALLY SEALED AND W/SWITCH |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
900.0 MILLIWATTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MULTIPLEXER, ANALOG |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| ADAU |
BODY HEIGHT |
0.180 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CZEQ |
TIME RATING PER CHACTERISTIC |
800.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1200.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP |
INPUT CIRCUIT PATTERN |
4 INPUT AND 8 CHANNEL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-15.0 VOLTS NOMINAL POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAT |
BODY WIDTH |
0.310 INCHES MAXIMUM |