| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+200.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-85 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
40.0 MILLIWATTS |
| CQZP |
INPUT CIRCUIT PATTERN |
4 WIDE 3-2-2-3 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CBBL |
FEATURES PROVIDED |
EXPANDABLE AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 GATE, AND-OR INVERT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
4.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 4.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAT |
BODY WIDTH |
0.160 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |