| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND W/ENABLE |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-20.0 VOLTS MINIMUM POWER SOURCE AND 18.0 VOLTS MAXIMUM POWER SOURCE |
| TEST |
TEST DATA DOCUMENT |
05869-717382-7 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAQ |
BODY LENGTH |
1.240 INCHES MINIMUM AND 1.260 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CRHL |
BIT QUANTITY (NON-CORE) |
1024 |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| ADAT |
BODY WIDTH |
0.515 INCHES MINIMUM AND 0.525 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CSWJ |
WORD QUANTITY (NON-CORE) |
256 |