| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
28.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| PMLC |
PRECIOUS MATERIAL AND LOCATION |
TERMINAL SURFACES GOLD |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND MEDIUM POWER AND POSITIVE OUTPUTS |
| PRMT |
PRECIOUS MATERIAL |
GOLD |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, NOR |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
12.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
94117-1310010 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PIN |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
54.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
TO-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
RESISTOR-TRANSISTOR LOGIC |
| CQSJ |
INCLOSURE MATERIAL |
METAL |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 2 INPUT |