5962-00-110-6425 ( ST32904LB8218 , C8297J , SL180D1 , ST32904LB8218 , C8297W , SE180J , ST32904LB8218 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-00-110-6425 | 5962 | 001106425 | MICROCIRCUIT,DIGITAL | 3177 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| TEST | TEST DATA DOCUMENT | 22915-ST32904 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 24.0 MILLIWATTS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAT | BODY WIDTH | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| ADAQ | BODY LENGTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CSSL | DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| ST32904LB8218 | 18324 | A | 2 | 3 | 1 | TX | |
| C8297J | 18324 | A | 9 | 5 | 3 | TX | |
| SL180D1 | 58625 | A | 2 | 5 | E | TX | |
| ST32904LB8218 | 22915 | A | 9 | 5 | 2 | TA | |
| C8297W | 18324 | A | 1 | 5 | 3 | TX | |
| SE180J | 18324 | A | 1 | 5 | 3 | TX | |
| ST32904LB8218 | 15124 | H | 9 | 5 | 5 | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| ST32904LB8218 | 18324 | PHILIPS SEMICONDUCTORS INC | A | A |
| C8297J | 18324 | PHILIPS SEMICONDUCTORS INC | A | A |
| SL180D1 | 58625 | LANSDALE SEMICONDUCTOR INC. | A | A |
| ST32904LB8218 | 22915 | NORTHROP GRUMMAN CORP | A | A |
| C8297W | 18324 | PHILIPS SEMICONDUCTORS INC | A | A |
| SE180J | 18324 | PHILIPS SEMICONDUCTORS INC | A | A |
| ST32904LB8218 | 15124 | PHILCO-FORD CORP | A | H |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | B | 3 | 08/09/1 | B | N | 8542900000 | 3177 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DF | N | SF9EH-N | F | ||
| DN | 9B----- | N | |||
| DA | Z | Q2200X- | A | ||
| DS | N | I |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| B | A | N | 0 | X | B |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DS | SMS | Z | 1 | EA | 0 | U | D | ||
| DA | SMS | Z | 1 | EA | 0 | U | Z | Q2200X- | A |
| DF | SMS | Z | 1 | EA | 0 | U | SF9EH-N | F | |
| DN | SMS | Z | 1 | EA | 0 | U | 9B----- | N |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|---|---|---|---|
| Q | 2 | 2 | 00 | X |
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 73930 | J | 657 | 3 | 9 | A | H | Z | ELEC APPLIANCES/INSTRUMENTS NOI |