| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
24930-G390064 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.070 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAT |
BODY WIDTH |
0.265 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| AFGA |
OPERATING TEMP RANGE |
+0.0/+75.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.265 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, NAND BUFFER |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |