| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
12 INPUT |
| CBBL |
FEATURES PROVIDED |
POSITIVE OUTPUTS AND BIPOLAR AND NEGATIVE OUTPUTS AND UNIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE AND WIRE-OR OUTPUTS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
307.2 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
09128-D34005544 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.070 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.390 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-20.0 VOLTS MINIMUM POWER SOURCE AND 8.3 VOLTS MAXIMUM POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
30 FLAT LEADS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAQ |
BODY LENGTH |
0.390 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CRHL |
BIT QUANTITY (NON-CORE) |
3072 |
| CSWJ |
WORD QUANTITY (NON-CORE) |
256 |