CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
50.0 VOLTS NOMINAL POWER SOURCE |
CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
AEHX |
MAXIMUM POWER DISSIPATION RATING |
450.0 MILLIWATTS |
ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
CQZP |
INPUT CIRCUIT PATTERN |
6 INPUT |
TEST |
TEST DATA DOCUMENT |
82577-3255027 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
CQWX |
OUTPUT LOGIC FORM |
CURRENT-MODE LOGIC |
CZER |
MEMORY DEVICE TYPE |
DIODE MATRIX |
CZEQ |
TIME RATING PER CHACTERISTIC |
20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
ADAQ |
BODY LENGTH |
0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |