| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND PLASTIC |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-10.0 VOLTS MINIMUM POWER SOURCE |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQWX |
OUTPUT LOGIC FORM |
EMITTER-COUPLED LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
| ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
190.0 MILLIWATTS |
| AFGA |
OPERATING TEMP RANGE |
+0.0/+75.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, AND-NAND AND 2 GATE, OR-NOR |
| CZEQ |
TIME RATING PER CHACTERISTIC |
8.50 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 8.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CBBL |
FEATURES PROVIDED |
HIGH SPEED AND EXPANDABLE AND NEGATIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND MEDIUM POWER |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAQ |
BODY LENGTH |
0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |