| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-30.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CRHL |
BIT QUANTITY (NON-CORE) |
1024 |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| CBBL |
FEATURES PROVIDED |
W/DISABLE AND W/DECODED OUTPUT AND BIPOLAR AND PROGRAMMED AND PROGRAMMABLE AND W/ENABLE AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND W/STORAGE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
650.0 MILLIWATTS |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| ADAU |
BODY HEIGHT |
0.070 INCHES MINIMUM AND 0.130 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
1.170 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| CSWJ |
WORD QUANTITY (NON-CORE) |
1024 |
| TEST |
TEST DATA DOCUMENT |
94117-310294 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.545 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |