| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
220.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| ADAU |
BODY HEIGHT |
0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND EDGE TRIGGERED AND MEDIUM SPEED AND MEDIUM POWER AND POSITIVE OUTPUTS AND MONOLITHIC AND W/CLEAR |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ |
BODY LENGTH |
0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
39.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| TEST |
TEST DATA DOCUMENT |
80249-911252 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 FLIP-FLOP, J-K, CLOCKED AND 2 FLIP-FLOP, J-K, MASTER SLAVE |