5962-00-407-7082 ( 649A819H01 , SH15043 , SHC1123H , 2202BE002 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-00-407-7082 | 5962 | 004077082 | MICROCIRCUIT,LINEAR | 3177 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TEST | TEST DATA DOCUMENT | 97942-649A819 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| ADAU | BODY HEIGHT | 0.160 INCHES NOMINAL |
| CZEQ | TIME RATING PER CHACTERISTIC | 12.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND POSITIVE OUTPUTS AND HYBRID AND MONOLITHIC AND NEGATIVE OUTPUTS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, GENERAL PURPOSE |
| CQZP | INPUT CIRCUIT PATTERN | 3 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | METAL |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| 649A819H01 | 97942 | A | 2 | 3 | 1 | TX | |
| SH15043 | 27014 | A | 2 | 5 | 5 | TX | |
| SHC1123H | 04713 | A | 9 | 5 | 5 | TX | |
| 2202BE002 | 15818 | F | 9 | 5 | 5 | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| 649A819H01 | 97942 | NORTHROP GRUMMAN SYSTEMS CORPORA | A | A |
| SH15043 | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| SHC1123H | 04713 | FREESCALE SEMICONDUCTOR INC. | F | A |
| 2202BE002 | 15818 | TELCOM SEMICONDUCTOR INC | A | F |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| U | X | Q | 3 | 01/20/1 | B | N | 8542900000 | 3177 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DN | 9N----- | N | Z | DISCONTINUED-USE 5962-01-263-0950 |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| Q | U | N | X | B |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DN | S9E | Y | 1 | EA | 0 | U | 9N----- | N |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 35325 | J | 658 | 3 | 5 | A | H | Y | ELEC APPLIANCES/INSTRUMENTS NOI |