| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
10 PIN |
| CZEQ |
TIME RATING PER CHACTERISTIC |
10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| ADAR |
BODY OUTSIDE DIAMETER |
0.355 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, NAND |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
190.0 MILLIWATTS |
| ADAU |
BODY HEIGHT |
0.170 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
36659-740651 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND POSITIVE OUTPUTS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 2 INPUT |