| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
W/ENABLE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND EDGE TRIGGERED |
| CZEQ |
TIME RATING PER CHACTERISTIC |
80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
13499-351-7503 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
1 INPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 FLAT LEADS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
150.0 MILLIWATTS |
| ADAQ |
BODY LENGTH |
0.360 INCHES MINIMUM AND 0.410 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
0.3 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |