| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| PMLC |
PRECIOUS MATERIAL AND LOCATION |
TEMINAL AND TOP AND BOTTOM SURFACES GOLD |
| PRMT |
PRECIOUS MATERIAL |
GOLD |
| CQZP |
INPUT CIRCUIT PATTERN |
12 INPUT |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| CZEQ |
TIME RATING PER CHACTERISTIC |
80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
13499-351-8063 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAR |
BODY OUTSIDE DIAMETER |
0.556 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 ARRAY, DELAY COMPENSATOR |
| TTQY |
TERMINAL TYPE AND QUANTITY |
34 FLAT LEADS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND DELAY, D-TYPE AND MONOLITHIC AND W/ENABLE |
| CSWJ |
WORD QUANTITY (NON-CORE) |
2 |
| ADAU |
BODY HEIGHT |
0.049 INCHES MINIMUM AND 0.068 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
150.0 MILLIWATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
0.3 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |