| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND HIGH SPEED AND INTERNALLY COMPENSATED |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-10.0 VOLTS MINIMUM POWER SOURCE AND 0.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX |
OUTPUT LOGIC FORM |
EMITTER-COUPLED LOGIC |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, OR-NOR |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
95.0 MILLIWATTS |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
4.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+175.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |