| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
11 INPUT |
| CRHL |
BIT QUANTITY (NON-CORE) |
2048 |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-30.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-015-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CBBL |
FEATURES PROVIDED |
W/DECODED OUTPUT AND HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND BIPOLAR AND W/ENABLE AND PROGRAMMABLE AND W/STORAGE AND PROGRAMMED |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.230 INCHES MAXIMUM |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
650.0 MILLIWATTS |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| ADAQ |
BODY LENGTH |
1.200 INCHES MINIMUM AND 1.290 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
92755-12793 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| ADAT |
BODY WIDTH |
0.515 INCHES MINIMUM AND 0.580 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CSWJ |
WORD QUANTITY (NON-CORE) |
256 |