| CRHL |
BIT QUANTITY (NON-CORE) |
200 |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
19133-902140 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+200.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-25.0 VOLTS MAXIMUM POWER SOURCE |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
PROGRAMMED AND HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND W/ENABLE AND POSITIVE OUTPUTS |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PIN |
| CQZP |
INPUT CIRCUIT PATTERN |
3 INPUT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 SHIFT REGISTER, DYNAMIC |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |