| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 FLIP-FLOP, R-S-T INPUT |
| ADAU |
BODY HEIGHT |
0.051 INCHES MINIMUM AND 0.063 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
DIRECT-COUPLED-TRANSISTOR LOGIC |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
24.7 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND LOW POWER AND ASYNCHRONOUS AND SYNCHRONOUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| TEST |
TEST DATA DOCUMENT |
81413-226161-000 DRAWING |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAQ |
BODY LENGTH |
0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
8.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |