| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND SYNCHRONOUS AND EXPANDABLE AND PROGRAMMABLE AND PROGRAMMED AND POSITIVE OUTPUTS |
| CQZP |
INPUT CIRCUIT PATTERN |
26 INPUT |
| ADAT |
BODY WIDTH |
0.500 INCHES NOMINAL |
| CZEQ |
TIME RATING PER CHACTERISTIC |
50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAQ |
BODY LENGTH |
1.970 INCHES NOMINAL |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
600.0 MILLIWATTS |
| AFJQ |
STORAGE TEMP RANGE |
-55.0/+150.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.090 INCHES NOMINAL |
| TEST |
TEST DATA DOCUMENT |
94117-310196 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MULTIPLEXER |
| TTQY |
TERMINAL TYPE AND QUANTITY |
40 PRINTED CIRCUIT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
0.3 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |