5962-00-759-0857 ( LH0002H883 , 7844929P001 , 320021P1 , 320021P1 )
NSN Information
| NSN | FSC | NIIN | Item Name | INC |
|---|---|---|---|---|
| 5962-00-759-0857 | 5962 | 007590857 | MICROCIRCUIT,LINEAR | 3177 |
NSN Features
| MRC | Parameter | Characteristics |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, HYBRID |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 600.0 MILLIWATTS |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 1 INPUT |
| TEST | TEST DATA DOCUMENT | 94117-320021 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| CBBL | FEATURES PROVIDED | HIGH POWER AND NEGATIVE OUTPUTS AND HYBRID AND HERMETICALLY SEALED AND POSITIVE OUTPUTS |
| CWSG | TERMINAL SURFACE TREATMENT | TIN |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | T0-78 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
Manufacturing Part Numbers (SKUs)
| Part SKU | Cage | Status | RNVC | RNCC | SADC | DAC | RNAAC |
|---|---|---|---|---|---|---|---|
| LH0002H883 | 27014 | A | 1 | 5 | 3 | TX | |
| 7844929P001 | 03538 | A | 2 | 5 | 2 | 9Z | |
| 320021P1 | 94117 | A | 2 | 3 | 1 | TX | |
| 320021P1 | 27014 | A | 2 | 5 | 5 | TX |
Manufacturers
| Part SKU | Cage | Manufacturer | Type | Status |
|---|---|---|---|---|
| LH0002H883 | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
| 7844929P001 | 03538 | LOCKHEED MARTIN CORPORATION | A | A |
| 320021P1 | 94117 | BAE SYSTEMS INFORMATION AND | A | A |
| 320021P1 | 27014 | NATIONAL SEMICONDUCTOR CORPORATI | A | A |
FLIS Identification
| PMIC | ADPE Code | CRITL Code | DEMIL Code | DEMIL INTG | NIIN Asgt | ESD | HMIC | ENAC | Schedule-B | INC |
|---|---|---|---|---|---|---|---|---|---|---|
| A | 0 | X | Q | 3 | 10/15/1 | N | 8542900000 | 3177 |
FLIS Management
| MOE | REC Rep Code | Mgmt Ctl | USC | Phrase Code | Phrase Statement |
|---|---|---|---|---|---|
| DM | Z | 1-E2--- | M | V | DISCONTINUED W/O REPLACEMENT |
| DN | 9N----- | N | Z | DISCONTINUED-USE 5962-01-263-0950 |
Demilitarization Codes & Management
| DML | PMI | HMIC | ADP | CC | ESDC |
|---|---|---|---|---|---|
| Q | A | N | 0 | X |
Miscellaneous Management
| MOE (S_A) | SOS | AAC | QUP | UI | SLC | CIIC | RC | MCC | SVC |
|---|---|---|---|---|---|---|---|---|---|
| DM | S9E | V | 1 | EA | 0 | U | Z | 1-E2--- | M |
| DN | S9E | V | 1 | EA | 0 | U | 9N----- | N |
Management Control Army
| MATCAT 1 | MATCAT 2 | MATCAT 3 | MATCAT 4 5 | ARC |
|---|
Freight
| NMFC | NMFC SUB | UFC | HMC | LTL | LCL | WCC | TCC | SHC | ADC | ACC | ASH | NMF DESC |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 061700 | X | 35325 | J | 658 | 3 | 5 | A | H | Y | ELEC APPLIANCES/INSTRUMENTS NOI |