| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+200.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.140 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
2 INPUT |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
450.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TEST |
TEST DATA DOCUMENT |
06481-970049 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFGA |
OPERATING TEMP RANGE |
-65.0/+175.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.2 VOLTS MINIMUM POWER SOURCE AND 5.0 VOLTS MAXIMUM POWER SOURCE |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.040 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
CURRENT-MODE LOGIC |
| CZER |
MEMORY DEVICE TYPE |
DIODE MATRIX |
| TTQY |
TERMINAL TYPE AND QUANTITY |
10 FLAT LEADS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |