| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 FLIP-FLOP, D-TYPE |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-STD-883 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ |
BODY LENGTH |
0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND HIGH SPEED AND W/CLEAR AND SCHOTTKY AND PRESETTABLE AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
150.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |