| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
11 INPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-004AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAT |
BODY WIDTH |
0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
275.0 MILLIWATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 COMPARATOR, MAGNITUDE |
| ADAQ |
BODY LENGTH |
0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
03640-6088658 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND W/DECODED OUTPUT AND EXPANDABLE |
| CSWJ |
WORD QUANTITY (NON-CORE) |
2 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CRHL |
BIT QUANTITY (NON-CORE) |
8 |