| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
125.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CBBL |
FEATURES PROVIDED |
PROGRAMMED AND MONOLITHIC |
| ADAT |
BODY WIDTH |
0.285 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
715.0 MILLIWATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| ADAU |
BODY HEIGHT |
0.085 INCHES MAXIMUM |
| CRHL |
BIT QUANTITY (NON-CORE) |
1024 |
| CZER |
MEMORY DEVICE TYPE |
PROM |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD |
| CZEQ |
TIME RATING PER CHACTERISTIC |
85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| ADAQ |
BODY LENGTH |
0.440 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CSWJ |
WORD QUANTITY (NON-CORE) |
256 |