| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.150 INCHES MINIMUM AND 0.199 INCHES MAXIMUM |
| CSWJ |
WORD QUANTITY (NON-CORE) |
64 |
| ADAQ |
BODY LENGTH |
0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
FIRST-IN FIRST-OUT |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
POSITIVE OUTPUTS AND RESETTABLE AND W/BUFFERED OUTPUT AND SYNCHRONOUS AND ASYNCHRONOUS AND MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND BIPOLAR |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
600.0 MILLIWATTS |
| AGAV |
END ITEM IDENTIFICATION |
PROCESSOR UNIT FSCM 81205 |
| ADAT |
BODY WIDTH |
0.285 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-STD-883 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| CRHL |
BIT QUANTITY (NON-CORE) |
256 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-20.0 VOLTS MINIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |