| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
18.5 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.750 INCHES MINIMUM AND 0.795 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CRHL |
BIT QUANTITY (NON-CORE) |
4 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
200.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
EDGE TRIGGERED AND W/CLEAR AND RESETTABLE AND POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND W/ENABLE AND MEDIUM SPEED |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
81349-MIL-STD-883 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| AGAV |
END ITEM IDENTIFICATION |
READ OUT BOX FSCM 81205 |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |