| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
12 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+200.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MAXIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CRHL |
BIT QUANTITY (NON-CORE) |
16 |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
262.0 MILLIWATTS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MULTIPLEXER |
| CBBL |
FEATURES PROVIDED |
POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND HIGH SPEED AND W/ENABLE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |