| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
3 GATE, AND |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 PRINTED CIRCUIT |
| ADAU |
BODY HEIGHT |
0.120 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 24.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| CQZP |
INPUT CIRCUIT PATTERN |
TRIPLE 3 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CBBL |
FEATURES PROVIDED |
POSITIVE OUTPUTS AND BURN IN, MIL-STD-883, CLASS B AND MONOLITHIC AND HIGH SPEED AND W/TOTEM POLE OUTPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
12.75 MILLIWATTS |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.640 INCHES MINIMUM AND 0.786 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND METAL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |