| CZEQ |
TIME RATING PER CHACTERISTIC |
15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
450.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
HIGH SPEED AND POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND EDGE TRIGGERED AND SCHOTTKY AND W/CLEAR AND W/ENABLE |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| ADAQ |
BODY LENGTH |
0.350 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.2 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 FLIP-FLOP, CLOCKED AND 6 FLIP-FLOP, D-TYPE |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-004-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |