| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0/+125.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
15.0 VOLTS MAXIMUM POWER SOURCE |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
-0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
HEX 1 INPUT |
| CZEQ |
TIME RATING PER CHACTERISTIC |
80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0/+150.0 DEG CELSIUS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAU |
BODY HEIGHT |
0.055 INCHES MINIMUM AND 0.140 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ |
BODY LENGTH |
0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 BUFFER, INVERTING AND 6 CONVERTER, LOGIC LEVEL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |